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Publications by Yasuhiro MATUMOTO
Direct Metallization Using Sulfonation of Coat-Type Epoxy Resin for Manufacture of Printed Wiring Board by "Build Up Process".
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Related publications
Blind via Hole in Multi-Layer AFRP Printed Wiring Boards by Build-Up Process
JSME International Journal Series A
Multilayer Printed Wiring Board Lamination
Automatic Inspection System for Printed Wiring Board Patterns.
The Journal of the Institute of Television Engineers of Japan
Process for Reinforcing SLS Parts by Epoxy Resin
Rapid Prototyping Journal
Industrial
Mechanical Engineering
Manufacturing Engineering
The Consideration for Automatic Exposure Equipment of Printed Wiring Board.
Circuit Technology
Investigation of Small-Diameter Drilling of GFRP for Printed Wiring Board
Nippon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C
Mechanics of Materials
Industrial
Mechanical Engineering
Manufacturing Engineering
Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Tin-Lead Plating Technology for Printed Wiring Board.
Journal of the Surface Finishing Society of Japan
Modification of Epoxy Resins by Resol Type Phenolic Resin.
Kobunshi Ronbunshu
Materials Science
Polymers
Plastics
Chemical Engineering
Environmental Science
Surge Endurance Characteristics Between Foil Conductors on Printed Wiring Board
IEEJ Transactions on Fundamentals and Materials
Electronic Engineering
Electrical
