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Publications by Yasuo OKUNO
A Study on Small Diameter Drilling of GFRP for Printed Wiring Board. Influence of Fiber Bundle Thickness of Plain Woven Cloth on Damage of Drilled Hole.
Nippon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C
Mechanics of Materials
Industrial
Mechanical Engineering
Manufacturing Engineering
Related publications
Investigation of Small-Diameter Drilling of GFRP for Printed Wiring Board
Nippon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C
Mechanics of Materials
Industrial
Mechanical Engineering
Manufacturing Engineering
Laser Drilling of Printed-Wiring Boards
Circuit Technology
Evaluation of Blind via Hole Quality on Multi-Layer Printed Wiring Boards by Cu Direct Laser Drilling
Zairyo/Journal of the Society of Materials Science, Japan
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Study on Effect of Drilling Rotational Speed and Tool Wear on Chip Evacuation of Micro Drilling of Printed Circuit Board
Transactions of the JSME (in Japanese)
Multilayer Printed Wiring Board Lamination
Investigation on Visibility of Drilled Hole in Laser Micro-Drilling of Multi-Layered Artificial Skin
International Journal of Electrical Machining
The Consideration for Automatic Exposure Equipment of Printed Wiring Board.
Circuit Technology
A Study on Anisotropy of Woven Cloth Laminates at Low Temperatures.
Zairyo/Journal of the Society of Materials Science, Japan
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Surge Endurance Characteristics Between Foil Conductors on Printed Wiring Board
IEEJ Transactions on Fundamentals and Materials
Electronic Engineering
Electrical
