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Publications by Yishou Wang
High Strain Survivability of Piezoceramics by Optimal Bonding Adhesive Design
Sensors
Instrumentation
Information Systems
Electronic Engineering
Biochemistry
Analytical Chemistry
Molecular Physics,
Electrical
Atomic
Medicine
Optics
Nondestructive Inspection of Composite Plates Using A0mode of Lamb Waves (Withdrawal Notice)
Related publications
Adhesive Bonding of Plastics
Journal of the Japan Society of Colour Material
Introduction to Adhesive Bonding Technology
Evaluation of Fatigue Damage in Adhesive Bonding: Part 1: Bulk Adhesive
Journal of Adhesion Science and Technology
Mechanics of Materials
Surfaces
Interfaces
Materials Chemistry
Films
Coatings
Chemistry
Adhesive Bonding of Resin Cements to Cast Titanium With Adhesive Primers
Brazilian Dental Journal
Dentistry
Characterisation and Modelling of Structural Bonding at High Strain Rate
EPJ Web of Conferences
Astronomy
Physics
A Comparative Study of the Bonding Energy in Adhesive Wafer Bonding
Journal of Micromechanics and Microengineering
Mechanics of Materials
Electronic Engineering
Mechanical Engineering
Nanoscience
Optical
Electrical
Magnetic Materials
Nanotechnology
Electronic
Ce:YIG/Silicon-on-Insulator Waveguide Optical Isolator Realized by Adhesive Bonding
Optics Express
Optics
Atomic
Molecular Physics,
Adhesive Bonding of Oily Steel: Shear Strength Studies
Effect of Electric Field Concentration by Electrode Patterning on the Incipient Piezoelectric Strain Properties of Lead-Free Piezoceramics
Journal of the Korean Ceramic Society
Composites
Ceramics