A Comparative Study of the Bonding Energy in Adhesive Wafer Bonding

Journal of Micromechanics and Microengineering - United Kingdom
doi 10.1088/0960-1317/23/8/085019
Full Text
Abstract

Available in full text

Date
Authors
Publisher

IOP Publishing

Related search

Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers

Journal of Photopolymer Science and Technology
Organic ChemistryPolymersMaterials ChemistryPlastics
2014English

Adhesive Bonding of Plastics

Journal of the Japan Society of Colour Material
1962English

Introduction to Adhesive Bonding Technology

2011English

Silicon Waveguides Produced by Wafer Bonding

Applied Physics Letters
AstronomyPhysics
2005English

Photoacoustic Imaging of Voids in Direct Wafer Bonding

Review of Scientific Instruments
MedicineInstrumentation
2000English

Low-Temperature Wafer Bonding for Three-Dimensional Wafer-Scale Integration

2018English

Evaluation of Fatigue Damage in Adhesive Bonding: Part 1: Bulk Adhesive

Journal of Adhesion Science and Technology
Mechanics of MaterialsSurfacesInterfacesMaterials ChemistryFilmsCoatingsChemistry
2010English

The Adhesive for Rubber-To-Metal Vulcanization Bonding

Journal of The Adhesion Society of Japan
2001English

Combined Surface-Activated Bonding Technique for Low-Temperature Hydrophilic Wafer Bonding With Interfacial Water Management

2015English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2024 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy