A Calculating Method for Temperature Distribution of IC Packages on a Printed Wiring Board. (1st Report. Temperature Distribution in the Thermal Wake of an IC Package).

Nihon Kikai Gakkai Ronbunshu, B Hen/Transactions of the Japan Society of Mechanical Engineers, Part B - Japan
doi 10.1299/kikaib.54.1730
Full Text
Abstract

Available in full text

Date
Authors
Publisher

Japan Society of Mechanical Engineers

Related search

Life Cycle Costing for IC Package

Journal of Life Cycle Assessment, Japan
2006English

The Need for a Full-Chip and Package Thermal Model for Thermally Optimized IC Designs

2005English

Interlayer Dielectrics for IC Package Substrate

Journal of Japan Institute of Electronics Packaging
Electronic EngineeringElectrical
2012English

Temperature Measurement of Flame in a Gasoline Engine : 2nd Report, Measurement of Temperature Distribution

Bulletin of the JSME
Engineering
1972English

Prediction of Thermal Sensation Based on Simulation of Temperature Distribution in a Vehicle Cabin.

Nihon Kikai Gakkai Ronbunshu, B Hen/Transactions of the Japan Society of Mechanical Engineers, Part B
Condensed Matter PhysicsMechanical Engineering
1999English

Path Integral Molecular Dynamics Simulation on Atomic Distribution in Amorphized Ice Ic

Natural Science
2016English

Multilayer Printed Wiring Board Lamination

1980English

Study of the Surface Temperature Distribution on Spot Heated Thermal Insulating Foams

Acta Physica Polonica A
AstronomyPhysics
2019English

Approximate Calculation of the Conduction of Heat (1st Report) : On the Temperature Distribution of the Infinite Solid With Circular Hollow

Transactions of the Japan Society of Mechanical Engineers
1952English

Amanote Research

Note-taking for researchers

Follow Amanote

© 2024 Amaplex Software S.P.R.L. All rights reserved.

Privacy PolicyRefund Policy