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Publications by Brahim BENSALEM
A Novel Efficient TSV Built-In Test for Stacked 3D ICs
Turkish Journal of Electrical Engineering and Computer Sciences
Electronic Engineering
Electrical
Computer Science
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Test Time Reduction of 3D Stacked ICs Using Ternary Coded Simultaneous Bi-Directional Signaling in Parallel Test Ports
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Multi-Functional Interconnect Co-Optimization for Fast and Reliable 3D Stacked ICs
A Charge Recycling Stacked I/O in Standard CMOS Technology for Wide TSV Data Bus
IEICE Electronics Express
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A Novel Scan Architecture for Power-Efficient, Rapid Test
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Low-Power Clock Tree Synthesis for 3d-ICs
ACM Transactions on Design Automation of Electronic Systems
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Adaptive Test With Test Escape Estimation for Mixed-Signal ICs
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Efficient Built-In Self-Test for Video Coding Cores: A Case Study on Motion Estimation Computing Array
Reconfigured Test Architecture Optimization for TSV-based Three-Dimensional SoCs
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Test Flow Selection for Stacked Integrated Circuits
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