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Publications by Choon-Sik Kang
Fluxless Wetting Properties of the UBM-Coated Si-Wafer to Pb-Free Solders Under Different Atmosphere
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Related publications
Effect of Excess Temperature Above Liquidus of Lead-Free Solders on Wetting Time in a Wetting Balance Test
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Influence of Interfacial Reaction on Reliability of QFP Joints With Sn-Ag Based Pb Free Solders
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Transformation Behavior and Properties of Carbide-Free Bainite Steels With Different Si Contents
Steel Research International
Alloys
Condensed Matter Physics
Metals
Theoretical Chemistry
Materials Chemistry
Physical
Wetting Properties of and Interfacial Reactions in Lead-Free Sn-Zn Based Solders on Cu and Cu Plated With an Electroless Ni-P/Au Layer
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Relationship Between Mechanical Properties of Lead-Free Solders and Their Heat Treatment Parameters
Journal of Materials Engineering and Performance
Mechanics of Materials
Materials Science
Mechanical Engineering
Microstructure and Mechanical Properties of Partial Melted Joint Using Off Eutectic Lead-Free Solders
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Properties of SnAgCu Solders Bearing Al Nanoparticles
Rupture Life of CSP Solder Joints With Sn-Ag Lead-Free Solders Under Thermal Cycle Condition.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Band Discontinuity Measurements of the Wafer Bonded InGaAs∕Si Heterojunction
Applied Physics Letters
Astronomy
Physics
