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Publications by Dan Maslyk
Drop Impact Reliability of Edge-Bonded Lead-Free Chip Scale Packages
Microelectronics Reliability
Surfaces
Electronic Engineering
Condensed Matter Physics
Electronic
Molecular Physics,
Nanoscience
Films
Optical
Electrical
Atomic
Magnetic Materials
Nanotechnology
Reliability
Safety
Coatings
Optics
Quality
Risk
Related publications
Analysis of Chip/Bump/Ceramic Interface of Flip-Chip Bonded LED Directly on Ceramic Packages
Journal of Light and Visual Environment
Electronic Engineering
Electrical
Channel Characterization for Chip-Scale Wireless Communications Within Computing Packages
Simulation of Micron-Scale Drop Impact
Computers and Mathematics with Applications
Mathematics
Computational Mathematics
Simulation
Modeling
Computational Theory
LLNL Small-Scale Drop-Hammer Impact Sensitivity Test
Probabilistic Methodology for Reliability Assessment of Electronic Packages
MATEC Web of Conferences
Materials Science
Engineering
Chemistry
Singular Stress Fields at Corners in Flip-Chip Packages
Engineering Fracture Mechanics
Mechanics of Materials
Materials Science
Mechanical Engineering
Transient Heat Transfer From a Free-Falling Molten Drop of Lead to a Cold Plate.
Journal of Chemical Engineering of Japan
Chemistry
Chemical Engineering
Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size Package With Underfill
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Near Free-Edge Stresses in FRP-to-concrete Bonded Joint Due to Mechanical and Thermal Loads
Scientia Iranica
