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Publications by G Stemme
Fabrication of an Infrared Emitter Using a Generic Integration Platform Based on Wire Bonding
Journal of Micromechanics and Microengineering
Mechanics of Materials
Electronic Engineering
Mechanical Engineering
Nanoscience
Optical
Electrical
Magnetic Materials
Nanotechnology
Electronic
A Comparative Study of the Bonding Energy in Adhesive Wafer Bonding
Journal of Micromechanics and Microengineering
Mechanics of Materials
Electronic Engineering
Mechanical Engineering
Nanoscience
Optical
Electrical
Magnetic Materials
Nanotechnology
Electronic
Related publications
Fabrication of a Micro-Hotplate for Application as an Infrared Emitter
Wire Bonding Using Offline Programming Method
Engineering
Wire Bonding Using Offline Programming Method
Engineering
Fabrication and Characterization of Cold Electron Emitter Based on Nanocrystalline Silicon Dots
Materials Research Society Symposium - Proceedings
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Fabrication and Characterization of a 3d-Structured Field Emitter Using Carbon Nanotube
Journal of Nanoscience and Nanotechnology
Materials Science
Condensed Matter Physics
Nanoscience
Bioengineering
Nanotechnology
Chemistry
Biomedical Engineering
The Development of Chemical Bonding Module Based on Science Generic Skill
OSA: An Integration Platform for Component-Based Simulation
Detection of Ethanol Concentration Using a Generic Optical Sensor Platform
Computacion y Sistemas
Computer Science
Stress-Minimized Packaging of Inertial Sensors Using Wire Bonding
