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Publications by Gurbinder Singh
Effect of Conduction Pre-Heating in Au-Al Thermosonic Wire Bonding
Journal of Surface Engineered Materials and Advanced Technology
Related publications
High-Strength and High-Speed Bonding Technology Using Thick Al-Ni Wire
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Effect of Shielding Gases on Ball Forming and Bondability in Copper Wire Bonding
Journal of Smart Processing
Influence of Surface Cleanness on Ultrasonic Ball Bondability of Au Wire Onto Au, Cu and Al Pads. Study of Ultrasonic Bonding With Surface Cleaning by Ion Bombardment(Report 2).
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society
Mechanics of Materials
Surfaces
Alloys
Mechanical Engineering
Metals
Films
Coatings
Wire Bonding Using Offline Programming Method
Engineering
Wire Bonding Using Offline Programming Method
Engineering
Reliability of Al Wire Bonding for SiC Power Modules Operating at Temperatures Above 200^|^deg;C
Journal of Smart Processing
Ultrasonic Aluminum Wire Bonding. Final Report
Evolution of Conduction Channel and Its Effect on Resistance Switching for Au-Wo3-X–Au Devices
Scientific Reports
Multidisciplinary
Stress-Minimized Packaging of Inertial Sensors Using Wire Bonding