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Publications by Gurbinder Singh

Effect of Conduction Pre-Heating in Au-Al Thermosonic Wire Bonding

Journal of Surface Engineered Materials and Advanced Technology
2011English

Related publications

High-Strength and High-Speed Bonding Technology Using Thick Al-Ni Wire

Materials Transactions
Mechanics of MaterialsMaterials ScienceCondensed Matter PhysicsMechanical Engineering
2002English

Effect of Shielding Gases on Ball Forming and Bondability in Copper Wire Bonding

Journal of Smart Processing
2013English

Influence of Surface Cleanness on Ultrasonic Ball Bondability of Au Wire Onto Au, Cu and Al Pads. Study of Ultrasonic Bonding With Surface Cleaning by Ion Bombardment(Report 2).

Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society
Mechanics of MaterialsSurfacesAlloysMechanical EngineeringMetalsFilmsCoatings
1998English

Wire Bonding Using Offline Programming Method

Engineering
2010English

Wire Bonding Using Offline Programming Method

Engineering
2010English

Reliability of Al Wire Bonding for SiC Power Modules Operating at Temperatures Above 200^|^deg;C

Journal of Smart Processing
2013English

Ultrasonic Aluminum Wire Bonding. Final Report

1980English

Evolution of Conduction Channel and Its Effect on Resistance Switching for Au-Wo3-X–Au Devices

Scientific Reports
Multidisciplinary
2014English

Stress-Minimized Packaging of Inertial Sensors Using Wire Bonding

2013English

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