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Publications by Jaesun Park
Bin2Vec: A Better Wafer Bin Map Coloring Scheme for Comprehensible Visualization and Effective Bad Wafer Classification
Applied Sciences (Switzerland)
Instrumentation
Materials Science
Fluid Flow
Engineering
Computer Science Applications
Process Chemistry
Transfer Processes
Technology
Related publications
Low-Temperature Wafer Bonding for Three-Dimensional Wafer-Scale Integration
Wafer-Fused Optoelectronics for Switching
Journal of Lightwave Technology
Optics
Atomic
Molecular Physics,
Wafer Topography-Aware Optical Proximity Correction for Better DOF Margin and CD Control
DynAMITe: A Wafer Scale Sensor for Biomedical Applications
Journal of Instrumentation
Instrumentation
Mathematical Physics
Wafer Scale Integration.
HYBRIDS
Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers
Journal of Photopolymer Science and Technology
Organic Chemistry
Polymers
Materials Chemistry
Plastics
Development of Uniform Press for Wafer Bonder
Transactions of the KSME C: Industrial Technology and Innovation
Laser Cleaving of Wafer for Electric Devices
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
Methanol Steam Reformer on a Silicon Wafer
Journal of Microelectromechanical Systems
Electronic Engineering
Electrical
Mechanical Engineering
