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Publications by Je-Hyun Youn
Erratum For: An On-Wafer Embedded Passive Device Using Chip-In-Substrate Packaging Technology
Microwave and Optical Technology Letters
Electronic Engineering
Condensed Matter Physics
Electronic
Molecular Physics,
Optical
Electrical
Atomic
Magnetic Materials
Optics
Related publications
Introduction of the Latest Activity of Device Embedded Substrate Technology Committee
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Attendance System Using NFC Technology With Embedded Camera on Mobile Device
IJARCCE
Embedded DRAM: Technology Platform for the Blue Gene/L Chip
IBM Journal of Research and Development
Computer Science
Characteristics of a Lock-In Thermography Signal From Solder Bump Cracking in Wafer-Level Chip Scale Packaging for Internet of Things Applications
Sensors and Materials
Materials Science
Instrumentation
Technology Trend of High Heat Dissipation AlN Substrate for Semiconductor Device
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Wafer-Level Flip Chip Packages Using Preapplied Anisotropic Conductive Films (ACFs)
IEEE Transactions on Electronics Packaging Manufacturing
Impact of Thermomechanical Stresses on Bumpless Chip in Stacked Wafer Structure
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
Engineering
Astronomy
Physics
Platform-Based Design for an Embedded-Fingerprint-Authentication Device
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Electrical
Software
Computer Graphics
Computer-Aided Design
Electronic Engineering
PPM Reduction on Embedded Memories in System on Chip
12th IEEE European Test Symposium (ETS'07)
