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Publications by Jin Yu Piao
Microstructure of Interface Between Sn-Cu Solder With Ni and Cu Plate
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Related publications
Phase Formation Between Lead-Free Sn–Ag–Cu Solder and Ni(P)∕Au Finishes
Journal of Applied Physics
Astronomy
Physics
Precipitation in a Cu-20%Ni-8%Sn Alloy and the Phase Diagram of the Cu-Ni Rich Cu-Ni-Sn System
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Microstructure Characterization of Sn-Ag-Cu Lead-Free Solder Solidified at Different Cooling Speeds
Microscopy and Microanalysis
Instrumentation
Interface Structure of Cu Wire Bonding on Cu Substrate With Sn Plating
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Microstructures and Properties of New Sn–Ag–Cu Lead-Free Solder Reinforced With Ni-Coated Graphene Nanosheets
Journal of Alloys and Compounds
Mechanics of Materials
Alloys
Materials Chemistry
Metals
Mechanical Engineering
Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface Between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate During Solid-State Aging
Scientific Reports
Multidisciplinary
Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
MATEC Web of Conferences
Materials Science
Engineering
Chemistry
Physico-Mechanical and Tribological Properties of Fe-Cu-Ni-Sn and Fe-Cu-Ni-Sn-Vn Nanocomposites Obtained by Powder Metallurgy Methods
Tribology in Industry
Mechanics of Materials
Surfaces
Mechanical Engineering
Interfaces
Films
Coatings
Age-Hardenability of Cu-Ni-Sn Sintered Compact
Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy
Alloys
Industrial
Mechanical Engineering
Metals
Materials Chemistry
Manufacturing Engineering
