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Publications by Kentei KOU

Formation of the Porous Film by Electroless Copper Plating.

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

Related publications

Direct Electroless Copper Plating on Alumina Ceramics.

Circuit Technology

English

Indirect Determination of pH in Electroless Copper Plating Bath by Spectrophotometry.

Journal of the Metal Finishing Society of Japan

English

Laser-Enhanced Electroless Nickel Plating on Polyimide Film.

Journal of the Surface Finishing Society of Japan

English

Preparation and Characterization of Copper Powders With Sn Coating by the Electroless Plating

Acta Physica Polonica A

English

Application of Precision Filtration on Electroless Copper Plating Bath.

Journal of the Surface Finishing Society of Japan

English

Electroless Plating

Journal of the Japan Society of Colour Material

English

Direct Circuit Formation Method on Aluminum Substrate by Electroless Nickel Plating.

Journal of the Surface Finishing Society of Japan

English

Plasma Graft Copolymerization of 4-Vinylpyridine on Dense and Porous SiLK for Electroless Plating of Copper and for Retardation of Copper Diffusion

Journal of the Electrochemical Society

Condensed Matter Physics

Electrochemistry

Materials Chemistry

Magnetic Materials

Renewable Energy

the Environment

English

Electroless Plating of Paper

Sen'i Gakkaishi

Materials Science

Manufacturing Engineering

Chemical Engineering

English