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Publications by Kojiro F.KOBAYASHI
Growth Kinetics of Intermetallic Compounds on the Boundary Between Au and In-48Sn Solder.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Related publications
Correlation Between Grain Boundary Structure and Grain Boundary Strength in Intermetallic Compounds;.
Bulletin of the Japan Institute of Metals
Reactivity Between Sn–Ag Solder and Au/Ni–Co Plating to Form Intermetallic Phases
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Structure and Kinetics of Sn Whisker Growth on Pb-Free Solder Finish
Growth Kinetics of Antiphase Domain in Ti3Al Intermetallic Compound
Science and Technology of Advanced Materials
Materials Science
Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
MATEC Web of Conferences
Materials Science
Engineering
Chemistry
Intermetallic Compounds
Effect of Lanthanum Doping on the Microstructure Evolution and Intermetallic Compound (IMC) Growth During Thermal Aging of SAC305 Solder Alloy
Journal of Material Science & Engineering
Diffusion in Intermetallic Compounds.
Bulletin of the Japan Institute of Metals
Intermetallic Compounds
