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Publications by M. Wiemer
Temporary Wafer Bonding – Key Technologogy for MEMS Devices
Nanoindustry Russia
Coherent Acoustic Phonons in Nanostructures Investigated by Asynchronous Optical Sampling
Related publications
Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers
Journal of Photopolymer Science and Technology
Organic Chemistry
Polymers
Materials Chemistry
Plastics
Low-Temperature Wafer Bonding for Three-Dimensional Wafer-Scale Integration
High-Efficient Chip to Wafer Self-Alignment and Bonding for Flexible and Size-Free MEMS-IC Integration
IEEJ Transactions on Sensors and Micromachines
Electronic Engineering
Electrical
Mechanical Engineering
A Review on Key Issues and Challenges in Devices Level MEMS Testing
Journal of Sensors
Control
Systems Engineering
Instrumentation
Electrical
Electronic Engineering
Laser Cleaving of Wafer for Electric Devices
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
Investigation of Flip-Chip Bonding for MEMS Applications
Journal of Electronic Packaging, Transactions of the ASME
Mechanics of Materials
Electronic Engineering
Optical
Computer Science Applications
Electrical
Magnetic Materials
Electronic
Silicon Waveguides Produced by Wafer Bonding
Applied Physics Letters
Astronomy
Physics
Electromagnetic MEMS Microspeaker for Portable Electronic Devices
Microsystem Technologies
Electronic Engineering
Condensed Matter Physics
Nanoscience
Hardware
Optical
Electrical
Architecture
Magnetic Materials
Nanotechnology
Electronic
A Comparative Study of the Bonding Energy in Adhesive Wafer Bonding
Journal of Micromechanics and Microengineering
Mechanics of Materials
Electronic Engineering
Mechanical Engineering
Nanoscience
Optical
Electrical
Magnetic Materials
Nanotechnology
Electronic
