Amanote Research
Register
Sign In
Discover open access scientific publications
Search, annotate, share and cite publications
Publications by M.L. Huang
Growth Kinetics of Cu6Sn5 Intermetallic Compound at Liquid-Solid Interfaces in Cu/Sn/Cu Interconnects Under Temperature Gradient
Scientific Reports
Multidisciplinary
5-Aza-2’-Deoxycytidine May Influence the Proliferation and Apoptosis of Cervical Cancer Cells via Demethylation in a Dose- And Time-Dependent Manner
Genetics and Molecular Research
Medicine
Genetics
Molecular Biology
Related publications
Growth Behavior of Intermetallic Compound in Dissimilar Al-Cu Joints Under Direct Current
Journal of Korean Institute of Metals and Materials
Surfaces
Alloys
Metals
Simulation
Optical
Magnetic Materials
Films
Modeling
Coatings
Electronic
Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
MATEC Web of Conferences
Materials Science
Engineering
Chemistry
Heterogeneous Nucleation of Cu6Sn5 in Sn–Cu–Al Solders
Journal of Alloys and Compounds
Mechanics of Materials
Alloys
Materials Chemistry
Metals
Mechanical Engineering
Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface Between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate During Solid-State Aging
Scientific Reports
Multidisciplinary
Kinetics of Reactive Diffusion in the (Sn–Cu)/Ni System at Solid-State Temperatures
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Steady State Deformation of Cu-Sn Solid Solutions at High Temperatures
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints
Scientific Reports
Multidisciplinary
Growth Kinetics of Antiphase Domain in Ti3Al Intermetallic Compound
Science and Technology of Advanced Materials
Materials Science
Effect of Melting Temperature on Wettability of Sn-Ag-Cu Alloys on Cu Substrate
Journal of Polytechnic
