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Publications by Makoto KITANO
Evaluation of Interface Delamination in IC Packages Considering the Swelling of Molding Compound Due to Moisture Absorption.
Transactions of the Japan Society of Mechanical Engineers Series A
A Method of Determining Reliability Testing Conditions for Solder Joints of Electronic Devices.
Transactions of the Japan Society of Mechanical Engineers Series A
Influence of Oxygen Concentration on Dislocation Generation at Stress Singularity Fields in Silicon Substrates.
Zairyo/Journal of the Society of Materials Science, Japan
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Structural Design of a Highly Reliable Fan-Out-Type Chip Scale Package.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
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