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Publications by Moongon Jung

A Fast Simulation Framework for Full-Chip Thermo-Mechanical Stress and Reliability Analysis of Through-Silicon-Via Based 3D ICs

2011English

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Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs

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KLauS – A Charge Readout and Fast Discrimination Chip for Silicon Photomultipliers

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Signal Integrity Analysis in Carbon Nanotube Based Through-Silicon Via

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3D Convolutional GAN for Fast Simulation

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