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Publications by Paul S. Ho
Bewlay, Gradečak, Heilshorn, Spolenak, and Venkatesan to Chair 2016 MRS Fall Meeting
MRS Bulletin
Materials Science
Theoretical Chemistry
Condensed Matter Physics
Physical
Erratum To: Micro-Fabricated Perforated Polymer Devices for Long-Term Drug Delivery
Biomedical Microdevices
Nanotechnology
Biomedical Engineering
Molecular Biology
Nanoscience
Thermal Stress Induced Delamination of Through Silicon Vias in 3-D Interconnects
Effect of Passivation on Stress Relaxation in Electroplated Copper Films
Journal of Materials Research
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Synchrotron X-Ray Microdiffraction Studies of Electromigration in Interconnect Lines at the Advanced Light Source
Chip-Package Interaction and Crackstop Study for Cu∕Ultra Low-K Interconnects
