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Publications by Peijun Ma
Solder Joints Detection Method Based on Surface Recovery
Computer and Information Science
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The Effect of Solder Paste Viscosity on Porosity and Mechanical Properties of Surface Mount Solder Joints
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
Evaluation Method of Thermal Fatigue Life for Surface-Mount Solder Joints by Mechanical Fatigue Test.
Transactions of the Japan Society of Mechanical Engineers Series A
A Method of Determining Reliability Testing Conditions for Solder Joints of Electronic Devices.
Transactions of the Japan Society of Mechanical Engineers Series A
Solder Joints Reliability Prediction. Thermo-Mechanical Fatigue: The Models Based on Creep Strain. Part 2
ELECTRONICS: Science, Technology, Business
Flux for Stronger Solder Joints on Ni-P/Au Electrodes
Transactions of The Japan Institute of Electronics Packaging
Stress Relaxation in 60Sn-40Pb Solder Joints
Journal of Electronic Materials
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Condensed Matter Physics
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Detection of Composite Delaminations and Broken Solder Joints by a Full-Field Laser Doppler Technique
Properties of Sn-Ag-Bi-In Solder Joints
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
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Evaluation of Fatigue Crack Initiation and Extension Life in Microelectronics Solder Joints of Surface Mount Type.
JSME International Journal Series A
