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Publications by R. Martinka
Temporary Wafer Bonding – Key Technologogy for MEMS Devices
Nanoindustry Russia
Related publications
Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers
Journal of Photopolymer Science and Technology
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Polymers
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Low-Temperature Wafer Bonding for Three-Dimensional Wafer-Scale Integration
High-Efficient Chip to Wafer Self-Alignment and Bonding for Flexible and Size-Free MEMS-IC Integration
IEEJ Transactions on Sensors and Micromachines
Electronic Engineering
Electrical
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A Review on Key Issues and Challenges in Devices Level MEMS Testing
Journal of Sensors
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Instrumentation
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Laser Cleaving of Wafer for Electric Devices
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
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Investigation of Flip-Chip Bonding for MEMS Applications
Journal of Electronic Packaging, Transactions of the ASME
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Computer Science Applications
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Silicon Waveguides Produced by Wafer Bonding
Applied Physics Letters
Astronomy
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Electromagnetic MEMS Microspeaker for Portable Electronic Devices
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Condensed Matter Physics
Nanoscience
Hardware
Optical
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Architecture
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A Comparative Study of the Bonding Energy in Adhesive Wafer Bonding
Journal of Micromechanics and Microengineering
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