Amanote Research
Register
Sign In
Discover open access scientific publications
Search, annotate, share and cite publications
Publications by Runhua Gao
Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface Between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate During Solid-State Aging
Scientific Reports
Multidisciplinary
Related publications
Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
MATEC Web of Conferences
Materials Science
Engineering
Chemistry
Creep-Fatigue Life Assessment for Sn-3.0Ag-0.5Cu Solder
Journal of Solid Mechanics and Materials Engineering
Microstructure of Interface Between Sn-Cu Solder With Ni and Cu Plate
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Growth Kinetics of Cu6Sn5 Intermetallic Compound at Liquid-Solid Interfaces in Cu/Sn/Cu Interconnects Under Temperature Gradient
Scientific Reports
Multidisciplinary
Reactivity Between Sn–Ag Solder and Au/Ni–Co Plating to Form Intermetallic Phases
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Effect of TiO2 Nanoparticles on the Horizontal Hardness Properties of Sn-3.0Ag-0.5Cu-1.0TiO2 Composite Solder
Ceramics International
Surfaces
Optical
Materials Chemistry
Process Chemistry
Technology
Magnetic Materials
Films
Composites
Electronic
Coatings
Ceramics
Evaluation of Absorbed Impact Energy of Sn-3.0Ag-0.5Cu (-xCo) Solder Joints With Co-P Plating a Using Ball Impact Test
Transactions of The Japan Institute of Electronics Packaging
Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints
Journal of Welding and Joining
Phase Decomposition During Aging for Cu-Ni-Cr Alloys
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
