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Publications by Seung-Min Chung
Fine Pitch and Low Temperature Bonding Using Solder Bumps and the Assessment of Solder Joint Reliability
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
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Liquid Phase Bonding Using Au Compliant Bumps for Fine-Pitch Solder Bump Interconnection
Electrolytic Deposition of Fine Pitch Sn/Cu Solder Bumps for Flip Chip Packaging
International Symposium on Microelectronics
Optoelectronic and Microwave Transmission Characteristics of Indium Solder Bumps for Low-Temperature Flip-Chip Applications
IEEE Transactions on Advanced Packaging
Ceramics Bonding Using Solder Glass Frit
Journal of Electronic Materials
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Bonding of Si Chips to Low Carbon Steel Boards Using Electroplated Sn Solder
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Coupled Microstructural and Calorimetric Investigation of Controlled Solder Joint Microstructures in Pb-Free Solder
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Microstructure and Mechanical Properties of Sn–0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method
Materials Transactions
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Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package
Journal of Korean Institute of Metals and Materials
Surfaces
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Optical
Magnetic Materials
Films
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Characterization of Indium and Solder Bump Bonding for Pixel Detectors
Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
High Energy Physics
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