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Publications by Shoei Tsuji
Study on Stiffness and Conditioning Effects of CMP Pad Based on Physical Die-Level CMP Model
Journal of the Electrochemical Society
Surfaces
Condensed Matter Physics
Optical
Electrochemistry
Sustainability
Materials Chemistry
Magnetic Materials
Renewable Energy
Films
Coatings
Electronic
the Environment
Related publications
Study on Reduction of Micro-Scratch in Oxide CMP for Multi-Level Interconnection
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
Fundamental Study on CMP Process Controlled With Optical Radiation Pressure.
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
Copper Surface Analyses After Cu CMP Processing
Electrochemistry
Electrochemistry
BulletProof: A Defect~Tolerant CMP Switch Architecture
Studies on Slurry Design Fundamentals for Advanced CMP Applications
ECS Transactions
Engineering
Re-Examining the Physical Basis of Pattern Density and Step Height CMP Models
Materials Research Society Symposium - Proceedings
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
CMP Inversion of Marine CSEM Data
Role of Amino-Acid Adsorption on Silica and Silicon Nitride Surfaces During STI CMP
Electrochemical and Solid-State Letters
Nanotopography Issues in Shallow Trench Isolation CMP
MRS Bulletin
Materials Science
Theoretical Chemistry
Condensed Matter Physics
Physical
