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Publications by Shou-Jen Hsu

Fluxless Tin Bonding Process With Suppressed Intermetallic Growth

IEEE Transactions on Components, Packaging and Manufacturing Technology

Electronic Engineering

Manufacturing Engineering

Magnetic Materials

English

Bonding of Si Chips to Low Carbon Steel Boards Using Electroplated Sn Solder

Soldering and Surface Mount Technology

Electronic Engineering

Condensed Matter Physics

Materials Science

English