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Publications by Shou-Jen Hsu
Fluxless Tin Bonding Process With Suppressed Intermetallic Growth
IEEE Transactions on Components, Packaging and Manufacturing Technology
Electronic Engineering
Industrial
Manufacturing Engineering
Optical
Electrical
Magnetic Materials
Electronic
Bonding of Si Chips to Low Carbon Steel Boards Using Electroplated Sn Solder
Soldering and Surface Mount Technology
Electronic Engineering
Electrical
Condensed Matter Physics
Materials Science
Related publications
Intermetallic Bonding for High-Temperature Microelectronics and Microsystems: Solid-Liquid Interdiffusion Bonding
Fluxless Flip-Chip Bonding of Single Photodetector Chips Using Laser-Induced Forward Transfer
Diffusion Bonding Process
Yosetsu Gakkai Shi/Journal of the Japan Welding Society
Mechanics of Materials
Surfaces
Alloys
Mechanical Engineering
Metals
Films
Coatings
The Process of Empathetic Bonding With Berniece Charles.
In-Situ Observation of Growth Behavior of Fe-Zn Intermetallic Compounds at Initial Stage of Galvannealing Process
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Oxidation and Reduction Kinetics of Eutectic SnPb, InSn and AuSn: A Knowledge Base for Fluxless Solder Bonding Applications
Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface Between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate During Solid-State Aging
Scientific Reports
Multidisciplinary
Process for Growth of Group-Iv Alloys Containing Tin by Remote Plasma Enhanced Chemical Vapor Deposition
Frontiers in Materials
Materials Science
Temperature Rise at Bonding Parts and Bonding Mechanism of Parallel Gap Bonding Method. Bonding Phenomena and Process Control on Electronic Materials With Fine Size 2nd Report.
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society
Mechanics of Materials
Surfaces
Alloys
Mechanical Engineering
Metals
Films
Coatings
