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Publications by Sung-Kyu Lim

A Fast Simulation Framework for Full-Chip Thermo-Mechanical Stress and Reliability Analysis of Through-Silicon-Via Based 3D ICs

2011English

Related publications

Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs

IEEE Transactions on Electron Devices
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2010English

Experimental Stress Characterization and Numerical Simulation for Copper Pumping Analysis of Through-Silicon Vias

IEEE Transactions on Components, Packaging and Manufacturing Technology
Electronic EngineeringIndustrialManufacturing EngineeringOpticalElectricalMagnetic MaterialsElectronic
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KLauS – A Charge Readout and Fast Discrimination Chip for Silicon Photomultipliers

Journal of Instrumentation
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2012English

Stress Analysis for Cylinder Made of FGM and Subjected to Thermo-Mechanical Loadings

Metals
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2018English

Analysis of Parallelization Efficiency of Coupled Thermo-Hydro-Mechanical Simulation

Journal of Environmental Science for Sustainable Society
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Multi-Functional Interconnect Co-Optimization for Fast and Reliable 3D Stacked ICs

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Signal Integrity Analysis in Carbon Nanotube Based Through-Silicon Via

Active and Passive Electronic Components
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3D Convolutional GAN for Fast Simulation

EPJ Web of Conferences
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X-Ray Nanodiffraction Analysis of Stress Oscillations in a W Thin Film on Through-Silicon Via

Journal of Applied Crystallography
BiochemistryGeneticsMolecular Biology
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