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Publications by Takanori HASHIZUME

Structural Design of a Highly Reliable Fan-Out-Type Chip Scale Package.

Journal of Japan Institute of Electronics Packaging

Electronic Engineering

English

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Integrated Design Methodology for Highly Reliable Liquid Rocket Engine

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Optimal and Robust Design Method for Two-Chip Out-Of-Plane Microaccelerometers

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Analysis of Weighted Fan-Out/Fan-in Volume Holographic Optical Interconnections

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