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Publications by Takanori HASHIZUME
Structural Design of a Highly Reliable Fan-Out-Type Chip Scale Package.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Related publications
Trend of BGACSPKGD. Flip-Chip Chip Size/Scale Package.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Design of a Highly Dependable Beamforming Chip
Chip Scale Package Fiber Optic Transceiver Integration for Harsh Environments
Fpga Based Highly Reliable Fault Tolerant Approach for Network on Chip(noc)
International Journal of Research in Engineering and Technology
Potentials of Chip-Package Co-Design for High-Speed Digital Applications
Integrated Design Methodology for Highly Reliable Liquid Rocket Engine
JOURNAL OF THE JAPAN SOCIETY FOR AERONAUTICAL AND SPACE SCIENCES
Wireless System-On-Chip and System-On-Package Design for Biomedical Applications
Optimal and Robust Design Method for Two-Chip Out-Of-Plane Microaccelerometers
Sensors
Instrumentation
Information Systems
Electronic Engineering
Biochemistry
Analytical Chemistry
Molecular Physics,
Electrical
Atomic
Medicine
Optics
Analysis of Weighted Fan-Out/Fan-in Volume Holographic Optical Interconnections
Applied Optics