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Publications by Teppei Imamura

Low-Temperature Direct Bonding of Flip-Chip Mountable VCSELs With Au-Au Surface Activation

IEEJ Transactions on Sensors and Micromachines

Electronic Engineering

Mechanical Engineering

English

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Investigation of Flip-Chip Bonding for MEMS Applications

Journal of Electronic Packaging, Transactions of the ASME

Mechanics of Materials

Electronic Engineering

Computer Science Applications

Magnetic Materials

English

Effect of Direction of Ultrasonic Vibration on Flip-Chip Bonding

Transactions of The Japan Institute of Electronics Packaging

English

Low Temperature Bonding for 3D Integration-Surface Activated Bonding (SAB)

English

Development of Millimeter-Wave ICs Using Flip-Chip Bonding Technology

English

Combined Surface-Activated Bonding Technique for Low-Temperature Hydrophilic Wafer Bonding With Interfacial Water Management

English

Low Temperature Direct Bonding Between PEEK (Polyetheretherketone) and Pt via Vapor-Assisted Vacuum Ultraviolet Surface Modification

Journal of Materials Science and Engineering B

English

Low-Temperature Bonding of Copper Pillars for All-Copper Chip-To-Substrate Interconnections

Electrochemical and Solid-State Letters

English

Optoelectronic and Microwave Transmission Characteristics of Indium Solder Bumps for Low-Temperature Flip-Chip Applications

IEEE Transactions on Advanced Packaging

English

Fluxless Flip-Chip Bonding of Single Photodetector Chips Using Laser-Induced Forward Transfer

English