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Publications by Tetsurou Yokoi
Ultra-Fine Pitch Electrical Feed Through Using Si Deep Etching and Bonding Wafer
IEEJ Transactions on Sensors and Micromachines
Electronic Engineering
Electrical
Mechanical Engineering
Related publications
Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers
Journal of Photopolymer Science and Technology
Organic Chemistry
Polymers
Materials Chemistry
Plastics
Liquid Phase Bonding Using Au Compliant Bumps for Fine-Pitch Solder Bump Interconnection
Etching Technologies of Silicon Wafer Using Dry Process
Journal of The Surface Finishing Society of Japan
Thinning Process Induced Surface Defects in Ultra-Thin Si Wafer
Kinematics of Ultra Precision Grinding for Large Scale Si Wafer.
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
Fine Pitch and Low Temperature Bonding Using Solder Bumps and the Assessment of Solder Joint Reliability
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Removal of Oxides and Surface Texturization of Crystalline Si Wafer by Ion Beam Etching
DEStech Transactions on Computer Science and Engineering
Deep Trench Fabrication by Si (110) Orientation Dependent Etching
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
Evaluation of Alignment Accuracy for Wafer Bonding Using Moire Technique
