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Publications by Tsutomu MIYACHI
Analysis of Chip/Bump/Ceramic Interface of Flip-Chip Bonded LED Directly on Ceramic Packages
Journal of Light and Visual Environment
Electronic Engineering
Electrical
Related publications
Singular Stress Fields at Corners in Flip-Chip Packages
Engineering Fracture Mechanics
Mechanics of Materials
Materials Science
Mechanical Engineering
Reliability of Flip Chip Package^|^mdash;Thermal Stress on Flip Chip Joint^|^mdash;
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Under Bump Metallisation of Fine Pitch Flip-Chip Using Electroless Nickel Deposition
Journal of Electronics Manufacturing
Drop Impact Reliability of Edge-Bonded Lead-Free Chip Scale Packages
Microelectronics Reliability
Surfaces
Electronic Engineering
Condensed Matter Physics
Electronic
Molecular Physics,
Nanoscience
Films
Optical
Electrical
Atomic
Magnetic Materials
Nanotechnology
Reliability
Safety
Coatings
Optics
Quality
Risk
Wafer-Level Flip Chip Packages Using Preapplied Anisotropic Conductive Films (ACFs)
IEEE Transactions on Electronics Packaging Manufacturing
Trend of BGACSPKGD. Flip-Chip Chip Size/Scale Package.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Substrate-Embedded and Flip-Chip-Bonded Photodetector Polymer-Based Optical Interconnects: Analysis, Design, and Performance
Journal of Lightwave Technology
Optics
Atomic
Molecular Physics,
Effect of Void Propagation on Bump Resistance Due to Electromigration in Flip-Chip Solder Joints Using Kelvin Structure
Applied Physics Letters
Astronomy
Physics
Effect of Direction of Ultrasonic Vibration on Flip-Chip Bonding
Transactions of The Japan Institute of Electronics Packaging
