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Publications by Y.-T. Cheng
Vacuum Packaging Technology Using Localized Aluminum/Silicon-to-Glass Bonding
Journal of Microelectromechanical Systems
Electronic Engineering
Electrical
Mechanical Engineering
Related publications
Anodic Bonding of Silicon Carbide to Borosilicate Glass
Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society
Mechanics of Materials
Surfaces
Alloys
Mechanical Engineering
Metals
Films
Coatings
Chemical Bonding in Vacuum Tight Glass-To-Metal Seals
The Journal of the Society of Chemical Industry, Japan
Fabrication of Nanofluidic Devices Using Glass-To-Glass Anodic Bonding
Sensors and Actuators, A: Physical
Surfaces
Electronic Engineering
Alloys
Condensed Matter Physics
Instrumentation
Metals
Optical
Electrical
Magnetic Materials
Films
Coatings
Electronic
Bonding Silicon-On-Insulator to Glass Wafers for Integrated Bio-Electronic Circuits
Applied Physics Letters
Astronomy
Physics
Ceramics Bonding Using Solder Glass Frit
Journal of Electronic Materials
Electronic Engineering
Condensed Matter Physics
Optical
Materials Chemistry
Electrical
Magnetic Materials
Electronic
Glass-Silicon Anodic Bonding for the Reduction of Structural Distortion
IEEJ Transactions on Fundamentals and Materials
Electronic Engineering
Electrical
Stress-Minimized Packaging of Inertial Sensors Using Wire Bonding
Introduction to Adhesive Bonding Technology
Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers
Journal of Photopolymer Science and Technology
Organic Chemistry
Polymers
Materials Chemistry
Plastics
