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Publications by Yoshio KAMI
Low-Loss, High-Q Spiral Inductor for Wafer Level CSP Using Cu Interconnect Technology With Polyimide Isolation Layer.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Introduction of Circuit Theory for Understanding EMC
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Related publications
Design and Modeling of a Micromachined High-Q Tunable Capacitor With Large Tuning Range and a Vertical Planar Spiral Inductor
IEEE Transactions on Electron Devices
Electronic Engineering
Optical
Electrical
Magnetic Materials
Electronic
Synthesis of Siloxane-Polyimide Copolymer With Low Birefringence and Low Loss for Optical Waveguide
Journal of Physical Science
Materials Science
Astronomy
Physics
System Level Interconnect Design for Network-On-Chip Using Interconnect IPs
High Power/Current Inductor Loss Measurement With Improved Shunt Resistor Construction
IEEJ Journal of Industry Applications
Electronic Engineering
Industrial
Mechanical Engineering
Energy Engineering
Automotive Engineering
Manufacturing Engineering
Electrical
Power Technology
Optimization of Spiral Inductor on Silicon
Wafer-Level Fabrication Process for Fully Encapsulated Micro-Supercapacitors With High Specific Energy
Microsystem Technologies
Electronic Engineering
Condensed Matter Physics
Nanoscience
Hardware
Optical
Electrical
Architecture
Magnetic Materials
Nanotechnology
Electronic
Design of an Active Inductor Based Low Noise Amplifier Using 180nm Cmos Technology for RF Receivers
International Journal for Research in Applied Science and Engineering Technology
Packaging Technology of BGA/CSP. Tape-Type BGA/CSP Technology.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Wireless Charge Based Capacitance Measurement Circuits With On-Chip Spiral Inductor for RFID Biosensor
