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Publications by Zarel Valdez-Nava
Co-Fired AlN–TiN Assembly as a New Substrate Technology for High-Temperature Power Electronics Packaging
Ceramics International
Surfaces
Optical
Materials Chemistry
Process Chemistry
Technology
Magnetic Materials
Films
Composites
Electronic
Coatings
Ceramics
Metallized Ceramic Substrate With Mesa Structure for Voltage Ramp-Up of Power Modules
EPJ Applied Physics
Instrumentation
Optical
Electronic
Condensed Matter Physics
Magnetic Materials
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Electronic Packaging Technology View From System Design. Packaging Technology Made New Capability in Electronics Use.
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Semiconductor Packaging Technology for 3D Assembly
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Present Conditions and Perspective of Electronics Components &Amp; Electronics Packaging Technology
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