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Simultaneous Power and Thermal Integrity Driven via Stapling in 3D ICs
IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers
- United States
doi 10.1145/1233501.1233666
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Categories
Computer Science Applications
Computer Graphics
Computer-Aided Design
Software
Date
January 1, 2006
Authors
Hao Yu
Joanna Ho
Lei He
Publisher
ACM Press
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