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Publications by Chukwudi Okoro
Synchrotron-Based Measurement of the Impact of Thermal Cycling on the Evolution of Stresses in Cu Through-Silicon Vias
Journal of Applied Physics
Astronomy
Physics
Related publications
Thermal Stress Induced Delamination of Through Silicon Vias in 3-D Interconnects
The Influence of Thermal Residual Stresses on Mechanical Properties of Silicon Nitride-Based Composites
Materials
Materials Science
Condensed Matter Physics
Integration of Electrografted Layers for the Metallization of Deep Through Silicon Vias
Electromagnetic Analysis for Optical Coherence Tomography Based Through Silicon Vias Metrology
Applied Optics
Electronic Engineering
Molecular Physics,
Engineering
Electrical
Atomic
Optics
Postbond Test of Through-Silicon Vias With Resistive Open Defects
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Hardware
Electronic Engineering
Electrical
Architecture
Software
The EFFECT OF OXIDATION, THERMAL CYCLING, AND IRRADIATION ON SILICON CARBIDE (SiC) COATED GRAPHITE
On the Relations Between the Fine Spherical Cementite and the Maximum Heating Temperature and Constrained Stresses of Thermal Cycling
Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Mechanics of Materials
Alloys
Materials Chemistry
Condensed Matter Physics
Metals
Measurement of the Residual Stresses and Investigation of Their Effects on a Hardfaced Grid Plate Due to Thermal Cycling in a Pool Type Sodium-Cooled Fast Reactor
Science and Technology of Nuclear Installations
Engineering
Nuclear Energy
Temperature Properties of the Parasitic Resistance of Through-Silicon Vias (TSVs) in High-Frequency 3-D ICs
IEICE Electronics Express
Electronic Engineering
Condensed Matter Physics
Optical
Electrical
Magnetic Materials
Electronic
