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Publications by F Forsberg

A Comparative Study of the Bonding Energy in Adhesive Wafer Bonding

Journal of Micromechanics and Microengineering

Mechanics of Materials

Electronic Engineering

Mechanical Engineering

Magnetic Materials

English

Related publications

Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers

Journal of Photopolymer Science and Technology

Organic Chemistry

Materials Chemistry

English

Adhesive Bonding of Plastics

Journal of the Japan Society of Colour Material

English

Introduction to Adhesive Bonding Technology

English

Silicon Waveguides Produced by Wafer Bonding

Applied Physics Letters

English

Photoacoustic Imaging of Voids in Direct Wafer Bonding

Review of Scientific Instruments

Instrumentation

English

Low-Temperature Wafer Bonding for Three-Dimensional Wafer-Scale Integration

English

Evaluation of Fatigue Damage in Adhesive Bonding: Part 1: Bulk Adhesive

Journal of Adhesion Science and Technology

Mechanics of Materials

Materials Chemistry

English

The Adhesive for Rubber-To-Metal Vulcanization Bonding

Journal of The Adhesion Society of Japan

English

Combined Surface-Activated Bonding Technique for Low-Temperature Hydrophilic Wafer Bonding With Interfacial Water Management

English