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Publications by J. D. Greenlee
Temporary Bonding With Polydimethylglutarimide Based Lift Off Resist as a Layer Transfer Platform
ECS Journal of Solid State Science and Technology
Optical
Electronic
Magnetic Materials
Related publications
Mixture of ZEP and PMMA With Varying Ratios for Tunable Sensitivity as a Lift-Off Resist With Controllable Undercut
Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics
Surfaces
Electronic Engineering
Condensed Matter Physics
Instrumentation
Electronic
Optical
Materials Chemistry
Electrical
Magnetic Materials
Films
Process Chemistry
Coatings
Technology
Dichromatic InGaN-based White Light Emitting Diodes by Using Laser Lift-Off and Wafer-Bonding Schemes
Applied Physics Letters
Astronomy
Physics
Low-Temperature Atomic-Layer-Deposition Lift-Off Method for Microelectronic and Nanoelectronic Applications
Applied Physics Letters
Astronomy
Physics
Mechanism of Lift-Off Phenomenon.
Materia Japan
Development of Lift-Off Photoresists With Unique Bottom Profile
Transactions of The Japan Institute of Electronics Packaging
Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers
Journal of Photopolymer Science and Technology
Organic Chemistry
Polymers
Materials Chemistry
Plastics
Robotic Patient Lift and Transfer
A Surface-Silylated Single-Layer Resist Using Chemical Amplification: A New Simpler Alternative for Multilayer Resist System.
Journal of Photopolymer Science and Technology
Organic Chemistry
Polymers
Materials Chemistry
Plastics
A Novel Alicyclic Polymers for 193nm Single Layer Resist Materials.
Journal of Photopolymer Science and Technology
Organic Chemistry
Polymers
Materials Chemistry
Plastics
