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Publications by Kevin Winstel
Low-Temperature Wafer Bonding for Three-Dimensional Wafer-Scale Integration
Related publications
Wafer Scale Integration.
HYBRIDS
Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers
Journal of Photopolymer Science and Technology
Organic Chemistry
Polymers
Materials Chemistry
Plastics
Review of Wafer-Level Three-Dimensional Integration (3DI) Using Bumpless Interconnects for Tera-Scale Generation
IEICE Electronics Express
Electronic Engineering
Condensed Matter Physics
Optical
Electrical
Magnetic Materials
Electronic
Combined Surface-Activated Bonding Technique for Low-Temperature Hydrophilic Wafer Bonding With Interfacial Water Management
Toward Human-Scale Brain Computing Using 3D Wafer Scale Integration
ACM Journal on Emerging Technologies in Computing Systems
Electronic Engineering
Nanoscience
Hardware
Electrical
Architecture
Nanotechnology
Software
Uniformity Study of Wafer-Scale InP-to-silicon Hybrid Integration
Applied Physics A: Materials Science and Processing
Materials Science
Chemistry
Three-Dimensional Photonic Crystal by Utilizing Wafer Fusion Technique.
The Review of Laser Engineering
Silicon Waveguides Produced by Wafer Bonding
Applied Physics Letters
Astronomy
Physics
Temporary Wafer Bonding – Key Technologogy for MEMS Devices
Nanoindustry Russia
