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Publications by Manabu TSUJIMURA
Copper Surface Analyses After Cu CMP Processing
Electrochemistry
Electrochemistry
CMP Technology for Interconnect of Semiconductor Device
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Mechanical Engineering
Upgrade of Polish Profile by Magnetic Control Head
Nippon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C
Mechanics of Materials
Industrial
Mechanical Engineering
Manufacturing Engineering
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