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Publications by Muhammad Sadiq
Effect of Lanthanum Doping on the Microstructure Evolution and Intermetallic Compound (IMC) Growth During Thermal Aging of SAC305 Solder Alloy
Journal of Material Science & Engineering
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Microstructure Evolution of Fe–Ni-Based Alloy HR6W During Isothermal Aging
Materials Transactions
Mechanics of Materials
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Condensed Matter Physics
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Effect of 0.05 Wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint During the Thermal Aging Process
Applied Sciences (Switzerland)
Instrumentation
Materials Science
Fluid Flow
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Computer Science Applications
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Technology
Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface Between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate During Solid-State Aging
Scientific Reports
Multidisciplinary
Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
MATEC Web of Conferences
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The Sintering Effect of Lanthanum-Calcium Manganite Doping on Microstructure and Non-Linear Coefficient of Zinc Oxide Varistor
Materials Science Forum
In Situ Investigation of SnAgCu Solder Alloy Microstructure
Journal of Alloys and Compounds
Mechanics of Materials
Alloys
Materials Chemistry
Metals
Mechanical Engineering
Effect of Aging on Corrosion Property, Electrochemical Behavior and Microstructure of 7075 Aluminum Alloy
Revista Tecnica de la Facultad de Ingenieria Universidad del Zulia
Engineering
Growth Kinetics of Intermetallic Compounds on the Boundary Between Au and In-48Sn Solder.
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Computer Simulation Study on Microstructure Evolution of Super Alloy During Tube Extrusion Deformation
DEStech Transactions on Computer Science and Engineering
