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Publications by Shoichi Kodama
Impact of Thermomechanical Stresses on Bumpless Chip in Stacked Wafer Structure
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
Engineering
Astronomy
Physics
Review of Wafer-Level Three-Dimensional Integration (3DI) Using Bumpless Interconnects for Tera-Scale Generation
IEICE Electronics Express
Electronic Engineering
Condensed Matter Physics
Optical
Electrical
Magnetic Materials
Electronic
Related publications
Plasmo-Thermomechanical Radiation Detector With On-Chip Optical Readout
Optics Express
Optics
Atomic
Molecular Physics,
Erratum For: An On-Wafer Embedded Passive Device Using Chip-In-Substrate Packaging Technology
Microwave and Optical Technology Letters
Electronic Engineering
Condensed Matter Physics
Electronic
Molecular Physics,
Optical
Electrical
Atomic
Magnetic Materials
Optics
Impact of Endometallofullerene on P84 Copolyimide Transport and Thermomechanical Properties
Polymers
Polymers
Plastics
Chemistry
Analysis of the Thermomechanical Load Impact on the Riveted Joint Strength
Mechanik
Impact of Wafer Deformation on Pattern Fabrication for Thermal Nanoimprint Lithography
Journal of Photopolymer Science and Technology
Organic Chemistry
Polymers
Materials Chemistry
Plastics
Annealing Effects on Ge/SiO2Interface Structure in Wafer-Bonded Germanium-On-Insulator Substrates
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
Engineering
Astronomy
Physics
Wafer-Level Flip Chip Packages Using Preapplied Anisotropic Conductive Films (ACFs)
IEEE Transactions on Electronics Packaging Manufacturing
Hybrid Stacked Memory Architecture for Energy Efficient Embedded Chip-Multiprocessors Based on Compiler Directed Approach
