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Publications by Shunsuke NEMOTO

Developing a Leading Practical Application for 3D IC Chip Stacking Technology

Synthesiology
EngineeringMultidisciplinarySocial Sciences
2016English

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Is 3D Chip Technology the Next Growth Engine for Performance Improvement?

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Millimeter-Wave Flip-Chip IC Module.

Journal of SHM
1997English

Extent and Relevance of Stacking Disorder in "Ice Ic"

Proceedings of the National Academy of Sciences of the United States of America
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2012English

3D Integration Technology: Status and Application Development

2010English

The Need for a Full-Chip and Package Thermal Model for Thermally Optimized IC Designs

2005English

Fault-Tolerant Vertical Link Design for Effective 3D Stacking

IEEE Computer Architecture Letters
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2011English

Saddle Add-On Metallization for RF-IC Technology

IEEE Transactions on Electron Devices
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Ice Ic Without Stacking Disorder by Evacuating Hydrogen From Hydrogen Hydrate

Nature Communications
AstronomyGeneticsMolecular BiologyBiochemistryChemistryPhysics
2020English

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