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Publications by Stefan Lutter

Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers

Journal of Photopolymer Science and Technology

Organic Chemistry

Materials Chemistry

English

Related publications

Temporary Wafer Bonding – Key Technologogy for MEMS Devices

Nanoindustry Russia

English

Low-Temperature Wafer Bonding for Three-Dimensional Wafer-Scale Integration

English

Combined Surface-Activated Bonding Technique for Low-Temperature Hydrophilic Wafer Bonding With Interfacial Water Management

English

A Comparative Study of the Bonding Energy in Adhesive Wafer Bonding

Journal of Micromechanics and Microengineering

Mechanics of Materials

Electronic Engineering

Mechanical Engineering

Magnetic Materials

English

Silicon Waveguides Produced by Wafer Bonding

Applied Physics Letters

English

Photoacoustic Imaging of Voids in Direct Wafer Bonding

Review of Scientific Instruments

Instrumentation

English

Evaluation of Alignment Accuracy for Wafer Bonding Using Moire Technique

English

Ultra-Fine Pitch Electrical Feed Through Using Si Deep Etching and Bonding Wafer

IEEJ Transactions on Sensors and Micromachines

Electronic Engineering

Mechanical Engineering

English

Dichromatic InGaN-based White Light Emitting Diodes by Using Laser Lift-Off and Wafer-Bonding Schemes

Applied Physics Letters

English