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Publications by T. Osipowicz
Plasma Graft Copolymerization of 4-Vinylpyridine on Dense and Porous SiLK for Electroless Plating of Copper and for Retardation of Copper Diffusion
Journal of the Electrochemical Society
Surfaces
Condensed Matter Physics
Optical
Electrochemistry
Sustainability
Materials Chemistry
Magnetic Materials
Renewable Energy
Films
Coatings
Electronic
the Environment
Effects of Microwave Power on the Structural and Emission Properties of Hydrogenated Amorphous Silicon Carbide Deposited by Electron Cyclotron Resonance Chemical Vapor Deposition
Journal of Applied Physics
Astronomy
Physics
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Formation of the Porous Film by Electroless Copper Plating.
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Direct Electroless Copper Plating on Alumina Ceramics.
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Application of Precision Filtration on Electroless Copper Plating Bath.
Journal of the Surface Finishing Society of Japan
Novel Formaldehyde-Free Electroless Copper for Plating on Next-Generation Substrates
International Symposium on Microelectronics
Ferrite and Copper Electroless Plating of Photopolymerized Resin for Micromolding of Three-Dimensional Structures
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
Engineering
Astronomy
Physics
Recrystallized Ice-Templated Electroless Plating for Fabricating Flexible Transparent Copper Meshes
RSC Advances
Chemistry
Chemical Engineering
EFTEM Mapping of Copper - Porous SiLK Structures
Microscopy and Microanalysis
Instrumentation
Preparation and Characterization of Copper Powders With Sn Coating by the Electroless Plating
Acta Physica Polonica A
Astronomy
Physics
Indirect Determination of pH in Electroless Copper Plating Bath by Spectrophotometry.
Journal of the Metal Finishing Society of Japan