Amanote Research
Register
Sign In
Discover open access scientific publications
Search, annotate, share and cite publications
Publications by Takehiko YANAGIDA
A Calculating Method for Temperature Distribution of IC Packages on a Printed Wiring Board. (1st Report. Temperature Distribution in the Thermal Wake of an IC Package).
Nihon Kikai Gakkai Ronbunshu, B Hen/Transactions of the Japan Society of Mechanical Engineers, Part B
Condensed Matter Physics
Mechanical Engineering
Related publications
Life Cycle Costing for IC Package
Journal of Life Cycle Assessment, Japan
The Need for a Full-Chip and Package Thermal Model for Thermally Optimized IC Designs
Interlayer Dielectrics for IC Package Substrate
Journal of Japan Institute of Electronics Packaging
Electronic Engineering
Electrical
Temperature Measurement of Flame in a Gasoline Engine : 2nd Report, Measurement of Temperature Distribution
Bulletin of the JSME
Engineering
Prediction of Thermal Sensation Based on Simulation of Temperature Distribution in a Vehicle Cabin.
Nihon Kikai Gakkai Ronbunshu, B Hen/Transactions of the Japan Society of Mechanical Engineers, Part B
Condensed Matter Physics
Mechanical Engineering
Path Integral Molecular Dynamics Simulation on Atomic Distribution in Amorphized Ice Ic
Natural Science
Multilayer Printed Wiring Board Lamination
Study of the Surface Temperature Distribution on Spot Heated Thermal Insulating Foams
Acta Physica Polonica A
Astronomy
Physics
Approximate Calculation of the Conduction of Heat (1st Report) : On the Temperature Distribution of the Infinite Solid With Circular Hollow
Transactions of the Japan Society of Mechanical Engineers
