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Publications by Tomoji Nakamura
Impact of Thermomechanical Stresses on Bumpless Chip in Stacked Wafer Structure
Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
Engineering
Astronomy
Physics
Integration of High Performance CMOS Logic LSI by Applying Cu Wiring to SiLKT.M./SiO2 Hybrid Structure
Materials Transactions
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
