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Publications by Yoriko Mizushima

Impact of Thermomechanical Stresses on Bumpless Chip in Stacked Wafer Structure

Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

English

Review of Wafer-Level Three-Dimensional Integration (3DI) Using Bumpless Interconnects for Tera-Scale Generation

IEICE Electronics Express

Electronic Engineering

Condensed Matter Physics

Magnetic Materials

English