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Publications by Joanna Ho
Simultaneous Power and Thermal Integrity Driven via Stapling in 3D ICs
IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers
Computer Science Applications
Computer Graphics
Computer-Aided Design
Software
Related publications
Low-Power Clock Tree Synthesis for 3d-ICs
ACM Transactions on Design Automation of Electronic Systems
Computer Science Applications
Electronic Engineering
Computer Graphics
Electrical
Computer-Aided Design
Accelerating Thermal Simulations of 3D ICs With Liquid Cooling Using Neural Networks
3d-Via Driven Partitioning for 3D VLSI Integrated Circuits
CLEI Electronic Journal
Efficient Power/Ground Network Analysis for Power Integrity-Driven Design Methodology
Simultaneous Stapling of Pulmonary Vein and Bronchus in Video-Assisted Thoracic Surgery Lobectomy
Annals of Thoracic and Cardiovascular Surgery
Gastroenterology
Cardiology
Cardiovascular Medicine
Medicine
Pulmonary
Respiratory Medicine
Surgery
Test Time Reduction of 3D Stacked ICs Using Ternary Coded Simultaneous Bi-Directional Signaling in Parallel Test Ports
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Electrical
Software
Computer Graphics
Computer-Aided Design
Electronic Engineering
A Study of Tapered 3-D TSVs for Power and Thermal Integrity
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Hardware
Electronic Engineering
Electrical
Architecture
Software
A Novel Efficient TSV Built-In Test for Stacked 3D ICs
Turkish Journal of Electrical Engineering and Computer Sciences
Electronic Engineering
Electrical
Computer Science
Data-Driven Partitioning of Power Networks via Koopman Mode Analysis
IEEE Transactions on Power Systems
Electronic Engineering
Power Technology
Electrical
Energy Engineering
