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Publications by Nisha Kuruvilla
Low-K Dielectric- A Potential Solution for Crosstalk Induced Signal Integrity Issues in SWCNT Interconnects
IOSR journal of VLSI and Signal Processing
Related publications
Bus Encoder for Crosstalk Avoidance in RLC Modeled Interconnects
International Journal of VLSI Design & Communication Systems
Crosstalk Analysis in Carbon Nanotube Bundle Interconnects
International Journal for Research in Applied Science and Engineering Technology
Chip-Package Interaction and Crackstop Study for Cu∕Ultra Low-K Interconnects
Effect of Driver Strength on Crosstalk in Global Interconnects
International Journal of Advanced Computer Science and Applications
Computer Science
Experiments and Simulation of Stress Induced Voiding Dependence on Upper Metal Cap Layer in Cu/Low K Interconnects
SOC Test-Architecture Optimization for the Testing of Embedded Cores and Signal-Integrity Faults on Core-External Interconnects
ACM Transactions on Design Automation of Electronic Systems
Computer Science Applications
Electronic Engineering
Computer Graphics
Electrical
Computer-Aided Design
Is a Low K+ Organ Preservation Solution Better for Vascular Endothelium?
Transplantation
Transplantation
Nanoindentation of Silicate Low-K Dielectric Thin Films
Materials Research Society Symposium - Proceedings
Mechanics of Materials
Materials Science
Condensed Matter Physics
Mechanical Engineering
Coding Approach for Low-Power 3D Interconnects
